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through-hole technology

Noun CEFR B2

Definitions

Mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side.

Examples

Coordinate term: surface-mount technology

CEFR level

B2
Upper Intermediate
This word is part of the CEFR B2 vocabulary — upper intermediate level.
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See also

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